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Independent verification when it matters most

For applications requiring additional verification, Tradius partners with internationally recognized testing laboratories specializing in electronic component authentication and quality analysis.

Methods Visual Electrical X-ray Decapsulation SEM XRF Solderability DPA

Testing is added where the risk is

Testing requirements vary depending on the component, application and customer specifications.

Which methods apply is a conversation, not a standard package: the risk profile of the part and the demands of the application decide what is worth doing.

Eight methods, available on request

Each is performed by a specialist laboratory. Which ones apply depends on the component and the application.

Visual inspection

Verification of markings, packaging, dimensions and physical condition.

Electrical testing

Functional verification against manufacturer specifications.

X-ray inspection

Internal construction analysis without damaging the component.

Decapsulation

Inspection of the semiconductor die and internal structures.

Scanning electron microscopy (SEM)

Microscopic analysis for high-risk applications.

XRF material analysis

Verification of material composition and RoHS-related testing.

Solderability testing

Evaluation of solder performance before production.

Destructive physical analysis (DPA)

Comprehensive examination for mission-critical applications.

Recommendations are tailored to your requirements and risk levels.

A part going into a safety-critical assembly is not treated like a part going into a bench tool. The testing recommendation says which methods we suggest, why, and what they cost in time.

Where testing sits in the process Step five of six - after risk assessment, before delivery.

Not sure what your part needs?

Send the part number and the application. A specialist tells you which verification is worth doing and which is not.